Articles with "tin film" as a keyword



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Mechanical and High-Temperature Tribological Properties of Cr3C2-NiCr/TiN Duplex Coating

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Published in 2020 at "Journal of Materials Engineering and Performance"

DOI: 10.1007/s11665-020-05226-6

Abstract: Preparation of duplex coating is an innovative way to improve components surface in terms of mechanical and tribological properties by the combination of high velocity oxy-fuel (HVOF) and physical vapor deposition (PVD) technologies. The present… read more here.

Keywords: cr3c2 nicr; tin; nicr tin; duplex coating ... See more keywords
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Direct growth of NiO nanosheets on mesoporous TiN film for energy storage devices

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Published in 2017 at "Applied Surface Science"

DOI: 10.1016/j.apsusc.2017.05.216

Abstract: Abstract We report an efficient energy storage electrode based on well-defined, interconnected NiO nanosheets (NiO-NS) grown directly on a mesoporous TiN ( meso -TiN) film via a solvothermal method. A mesoporous TiO 2 ( meso… read more here.

Keywords: meso; energy storage; meso tin; tin ... See more keywords
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Molecular Dynamics Simulation of the Incident Energy Effect on the Properties of TiN Films

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Published in 2023 at "Coatings"

DOI: 10.3390/coatings13040794

Abstract: In this work, to investigate the physical vapor deposition (PVD)-deposited TiN coating on the TiN(001) substrate, the process was simulated using the molecular dynamics (MD) method with the 2NN-MEAM (nearest-neighbor modified embedded atom method) potential.… read more here.

Keywords: tin; tin film; incident energy;
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Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

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Published in 2023 at "Inorganics"

DOI: 10.3390/inorganics11050204

Abstract: In this work, the deposition of titanium nitride (TiN) thin film using direct current (DC) sputtering technique and its application as diffusion barriers against copper interconnect was presented. The deposited film was analyzed by using… read more here.

Keywords: tin thin; tin; film; diffusion barriers ... See more keywords