In-situ study of electrochemical migration of tin in the presence of bromide ion.
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DOI: 10.1038/s41598-021-95276-0
Abstract: The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the… read more here.
Keywords: tin presence; electrochemical migration; presence bromide; presence ... See more keywords