Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life
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DOI: 10.1016/j.microrel.2020.113651
Abstract: Abstract Lead free (LF) solders such as tin silver copper (SAC) and its variations have been used in microelectronic products for the past decade due the Restriction of Hazardous Substances regulation. In use, temperature cycling… read more here.
Keywords: silver copper; fatigue life; energy; solder ... See more keywords