Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings
Sign Up to like & getrecommendations! Published in 2019 at "Polymer Degradation and Stability"
DOI: 10.1016/j.polymdegradstab.2019.05.019
Abstract: Abstract Tin whisker growth, which may lead to short circuits and current leakage, is a serious issue in electronics components. Polyurethane-based conformal coatings have been seen as an effective candidate to mitigate the tin whisker… read more here.
Keywords: adhesion; tin; degradation; tin whisker ... See more keywords
Long-term thermal aging of parylene conformal coating under high humidity and its effects on tin whisker mitigation
Sign Up to like & getrecommendations! Published in 2021 at "Polymer Degradation and Stability"
DOI: 10.1016/j.polymdegradstab.2021.109667
Abstract: Abstract Usage of pure tin (Sn) or Sn-rich alloy in electronics industry is growing, which makes them more susceptible to the spontaneous growth of tin whiskers. The risk of having these whiskers can be dramatically… read more here.
Keywords: parylene; tin; tin whisker; high humidity ... See more keywords
Growth behavior of tin whisker on SnAg microbump under compressive stress
Sign Up to like & getrecommendations! Published in 2018 at "Scripta Materialia"
DOI: 10.1016/j.scriptamat.2018.01.014
Abstract: Abstract Tin whiskers with different morphologies form on SnAg microbumps under long-term compressive stress. High resolution transmission electron microscopy results reveal that dislocations and stacking faults can be found inside tin whiskers and the neighboring… read more here.
Keywords: whisker; compressive stress; tin whisker; tin ... See more keywords
Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints
Sign Up to like & getrecommendations! Published in 2019 at "Applied Sciences"
DOI: 10.3390/app9071406
Abstract: The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn3 phase nor… read more here.
Keywords: whisker growth; tin whisker; soldered joints;