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Published in 2019 at "Polymer Degradation and Stability"
DOI: 10.1016/j.polymdegradstab.2019.05.019
Abstract: Abstract Tin whisker growth, which may lead to short circuits and current leakage, is a serious issue in electronics components. Polyurethane-based conformal coatings have been seen as an effective candidate to mitigate the tin whisker…
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Keywords:
adhesion;
tin;
degradation;
tin whisker ... See more keywords
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Published in 2021 at "Polymer Degradation and Stability"
DOI: 10.1016/j.polymdegradstab.2021.109667
Abstract: Abstract Usage of pure tin (Sn) or Sn-rich alloy in electronics industry is growing, which makes them more susceptible to the spontaneous growth of tin whiskers. The risk of having these whiskers can be dramatically…
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Keywords:
parylene;
tin;
tin whisker;
high humidity ... See more keywords
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Published in 2018 at "Scripta Materialia"
DOI: 10.1016/j.scriptamat.2018.01.014
Abstract: Abstract Tin whiskers with different morphologies form on SnAg microbumps under long-term compressive stress. High resolution transmission electron microscopy results reveal that dislocations and stacking faults can be found inside tin whiskers and the neighboring…
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Keywords:
whisker;
compressive stress;
tin whisker;
tin ... See more keywords
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Published in 2019 at "Applied Sciences"
DOI: 10.3390/app9071406
Abstract: The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn3 phase nor…
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Keywords:
whisker growth;
tin whisker;
soldered joints;