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Published in 2023 at "International Journal of Molecular Sciences"
DOI: 10.3390/ijms24076325
Abstract: With the tendency of thermoelectric semiconductor devices towards miniaturization, integration, and flexibility, there is an urgent need to develop high-performance thermoelectric materials. Compared with the continuously enhanced thermoelectric properties of thermoelectric materials, the understanding of…
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Keywords:
mechanisms applications;
toughening thermoelectric;
thermoelectric materials;
materials mechanisms ... See more keywords