Towards virtual twin for electronic packages in automotive applications
Sign Up to like & getrecommendations! Published in 2021 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2021.114134
Abstract: Abstract The piezoresistive silicon based stress sensor has the potential to be part of the Digital Twin implementation in automotive electronics. One solution to enforce reliability in digital twins is the use of Machine Learning… read more here.
Keywords: electronic packages; delamination; stress; towards virtual ... See more keywords