Transferable-Tip Technology for Fine-Pitch Probes and Interconnections
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DOI: 10.1109/tcpmt.2019.2925589
Abstract: A transferable-tip technology has been developed that has applications for wafer-level fine-pitch probe and electrical test of semiconductor devices. The tips are made by filling a mold made in a (100)-oriented Si substrate wafer, with… read more here.
Keywords: transferable tip; test; fine pitch; tip technology ... See more keywords