Kinetic Control of Ultrafast Transient Liquid Assisted Growth of Solution‐Derived YBa2Cu3O7‐x Superconducting Films
Sign Up to like & getrecommendations! Published in 2022 at "Advanced Science"
DOI: 10.1002/advs.202203834
Abstract: Transient liquid assisted growth (TLAG) is an ultrafast non‐equilibrium growth process mainly governed by kinetic parameters, which are only accessible through fast in situ characterizations. In situ synchrotron X‐ray diffraction (XRD) analysis and in situ… read more here.
Keywords: superconducting films; growth; assisted growth; liquid assisted ... See more keywords
Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7554-6
Abstract: Fluxless bonding of plateless Cu–Cu substrates at processing temperature lower than 250 °C and low pressure of 0.1 MPa was achieved by transient liquid phase sintering (TLPS) of mixed Cu nanoparticles and Sn–Bi eutectic powders. The effects… read more here.
Keywords: phase; transient liquid; temperature; liquid phase ... See more keywords
Understanding of Void Formation in Cu/Sn-Sn/Cu System During Transient Liquid Phase Bonding Process Through Diffusion Modeling
Sign Up to like & getrecommendations! Published in 2018 at "Metallurgical and Materials Transactions B"
DOI: 10.1007/s11663-018-1391-8
Abstract: Transient Liquid Phase (TPL) bounding of Sn foil sandwiched between two Cu foils involves, in the temperature range above the melting point of Sn (232 °C) and below 350 °C, the formation and the growth of two… read more here.
Keywords: phase; transient liquid; diffusion; void formation ... See more keywords
A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-017-5357-4
Abstract: A transient liquid phase sintering (TLPS) bonding process, Ni-Sn TLPS bonding was developed for the new generation of power semiconductor packaging. A model Ni/Ni-Sn/Ni sandwiched structure was assembled by using 30Ni-70Sn mixed powder as the… read more here.
Keywords: transient liquid; temperature; liquid phase; bonding process ... See more keywords
Transient Liquid Phase Bonding of 2205 Duplex Stainless Steel Using a Ni-P Interlayer
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Engineering and Performance"
DOI: 10.1007/s11665-020-04758-1
Abstract: Transient liquid phase (TLP) bonding was successfully applied to join 2205DSS using a Ni-P interlayer. Microstructural studies revealed that isothermal solidification (IS) progressed via formation of γ-Fe solid solution from the base metal (BM)/bonding zone… read more here.
Keywords: transient liquid; liquid phase; tlp bonded; bonded specimen ... See more keywords
Microstructure Evolution Mechanism and Corrosion Behavior of Transient Liquid Phase Bonded 304L Stainless Steel
Sign Up to like & getrecommendations! Published in 2020 at "Metals and Materials International"
DOI: 10.1007/s12540-020-00671-3
Abstract: Abstract Transient liquid phase (TLP) bonding of 304L austenitic stainless steel was carried out using MBF-20 interlayer at 1070 °C with different holding times. The effect of bonding time on the microstructure and corrosion resistance of… read more here.
Keywords: phase; transient liquid; liquid phase; stainless steel ... See more keywords
Transient Liquid Phase Bonding of 17-4-PH Stainless Steel Using Conventional and Two-Step Heating Process
Sign Up to like & getrecommendations! Published in 2020 at "Metals and Materials International"
DOI: 10.1007/s12540-020-00792-9
Abstract: Conventional and two-step heating transient liquid phase bonding (TLP) experiments of martensitic precipitation hardening stainless steel 17-4-PH were studied employing AMS 4777 braze filler at temperature of 1050 °C for different times (15 to 90… read more here.
Keywords: phase; step heating; transient liquid; two step ... See more keywords
Diffusion kinetics of transient liquid phase bonding of Ni-based superalloy with Ni nanoparticles: A molecular dynamics perspective
Sign Up to like & getrecommendations! Published in 2018 at "Computational Materials Science"
DOI: 10.1016/j.commatsci.2018.05.056
Abstract: Abstract Transient liquid phase (TLP) bonding has been broadly utilized to join and repair Ni-based superalloy components; however, the understanding of its diffusion kinetics is still in infancy due to challenges in in situ experimental… read more here.
Keywords: transient liquid; diffusion; liquid phase; based superalloy ... See more keywords
Microstructural evolution and mechanical properties in the partial transient liquid phase diffusion bonding of tungsten to steel
Sign Up to like & getrecommendations! Published in 2018 at "International Journal of Refractory Metals and Hard Materials"
DOI: 10.1016/j.ijrmhm.2018.02.002
Abstract: Abstract The paper describes the design and examination of Ti/Cu double interlayer to produce a joint between tungsten and steel. Partial transient liquid phase diffusion bonding was performed by a double stage bonding process. To… read more here.
Keywords: transient liquid; diffusion; liquid phase; tungsten steel ... See more keywords
Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC technologies
Sign Up to like & getrecommendations! Published in 2017 at "Intermetallics"
DOI: 10.1016/j.intermet.2017.02.021
Abstract: Abstract This study focuses on the formation mechanism of impinged-grain of Cu 6 Sn 5 and interfolded-grain of Cu 6 (Sn,Zn) 5 in Cu/Sn-3.5Ag/Cu and Cu/Sn-3.5Ag/Cu-15Zn (wt %) transient liquid-phase (TLP) bonding after reflow, respectively.… read more here.
Keywords: novel technologies; grain structure; transient liquid; liquid phase ... See more keywords
Phase formation and evolution during transient liquid phase sintering of MIM418 superalloy with master alloy addition
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2020.154583
Abstract: Abstract Phase formation and evolution during transient liquid phase sintering of MIM418 superalloy fabricated via master alloy approach have been investigated through a combination of thermo-dynamic calculation and diffusion couple method. Diffusion couple experimental results… read more here.
Keywords: transient liquid; phase; master alloy; liquid phase ... See more keywords