D‐band waveguide‐to‐microstrip transition implemented in eWLB packaging technology
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DOI: 10.1049/el.2019.3331
Abstract: This Letter presents a non-galvanic D-band (110-170 GHz) interconnect realised in embedded wafer level ball grid array (eWLB) packaging technology. The interconnect consists of a patch-radiator-based waveguide transition implemented using one of the technology's redistribution… read more here.
Keywords: transition implemented; ewlb packaging; band; technology ... See more keywords