The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7558-2
Abstract: We investigated the mechanical property of Cu–Cu joints bonded using an ultrasonic bonding and evaluated the reliability of 3D structure stacked by through silicon via (TSV) on glass substrate. TSV was fabricated by using the… read more here.
Keywords: reliability ultrasonic; ultrasonic bonded; bonding strength; tsv ... See more keywords
Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading
Sign Up to like & getrecommendations! Published in 2019 at "Engineering Fracture Mechanics"
DOI: 10.1016/j.engfracmech.2019.01.030
Abstract: Abstract The anisotropy property of silicon is a basic property which has been discussed widely in the reliability assessment of electronic components. However, the effect of silicon anisotropy on the fracture behavior of through-silicon-via (TSV)… read more here.
Keywords: effect silicon; silicon; silicon anisotropy; crack ... See more keywords
Precision 3D profile in-line measurement of through-silicon via (TSV) based on high-frequency spectrum signals in the pupil plane
Sign Up to like & getrecommendations! Published in 2018 at "Optics Communications"
DOI: 10.1016/j.optcom.2018.04.033
Abstract: Abstract As a deep and fine vertical via, through-silicon via (TSV) is a key factor in three-dimensional (3D) integrated circuit stack, which can pass through a silicon wafer or chip for 3D integration. TSV’s 3D… read more here.
Keywords: high frequency; pupil plane; tsv; silicon ... See more keywords
Fabrication and measurement of 3D LPF based on coaxial TSV
Sign Up to like & getrecommendations! Published in 2019 at "Electronics Letters"
DOI: 10.1049/el.2018.7325
Abstract: The implementation of mainstream passive low-pass filters (LPFs) remains a challenge to satisfy the requirements of small size and compatibility with standard CMOS process. Fortunately, the emerging technology of through-silicon via (TSV) offers a possible… read more here.
Keywords: fabrication measurement; lpf based; measurement; based coaxial ... See more keywords
Internal defects inspection of TSV 3D package based on thermal distribution analysis
Sign Up to like & getrecommendations! Published in 2021 at "AIP Advances"
DOI: 10.1063/5.0056714
Abstract: A small aperture, fine pitch, and high aspect ratio have been the characteristics of through silicon via (TSV) 3D packaging technology. Thus, the requirements of TSV quality are becoming higher and higher. In order to… read more here.
Keywords: internal defects; defects inspection; internal defect; tsv ... See more keywords
First report of tobacco streak virus on Echinacea purpurea (Linn.) Moench in China.
Sign Up to like & getrecommendations! Published in 2022 at "Plant disease"
DOI: 10.1094/pdis-01-22-0216-pdn
Abstract: Tobacco streak virus (TSV) is a member of the genus Ilarvirus in the family Bromoviridae (Vinodkumar et al. 2017). TSV is transmitted by thrips, seeds, pollen, and mechanical injury and has a broad host range,… read more here.
Keywords: tobacco; echinacea purpurea; supplementary fig; virus ... See more keywords
TSV-Defect Modeling, Detection and Diagnosis Based on 3-D Full Wave Simulation and Parametric Measurement
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Access"
DOI: 10.1109/access.2018.2879640
Abstract: In this paper, we present a TSV low-bandwidth equivalent lumped circuit model of common TSV defects as analyzed using a high-frequency structure simulator 3-D full wave simulation. By using the proposed model, the physical parameters… read more here.
Keywords: diagnosis; full wave; wave simulation; tsv defect ... See more keywords
First-Last: A Cost-Effective Adaptive Routing Solution for TSV-Based Three-Dimensional Networks-on-Chip
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Computers"
DOI: 10.1109/tc.2018.2822269
Abstract: 3D integration opens up new opportunities for future multiprocessor chips by enabling fast and highly scalable 3D Network-on-Chip (NoC) topologies. However, in an aim to reduce the cost of Through-silicon via (TSV), partially vertically connected… read more here.
Keywords: first last; last cost; tsv; adaptive routing ... See more keywords
Cellular Structure-Based Fault-Tolerance TSV Configuration in 3D-IC
Sign Up to like & getrecommendations! Published in 2022 at "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"
DOI: 10.1109/tcad.2021.3084920
Abstract: In 3-D integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, the yield is one of the key obstacles to adopt the TSV-based 3D-ICs technology in industry. Various… read more here.
Keywords: configuration; structure; tsv; fault tolerance ... See more keywords
High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2018.2853405
Abstract: In this paper, high-frequency electrothermal characteristics of the power delivery network (PDN) are investigated for through-silicon-via (TSV)-based 3-D ICs by utilizing a self-developed electrothermal co-simulation solver. The solver circularly solves the full-wave electromagnetic equation and… read more here.
Keywords: high frequency; power delivery; frequency; power ... See more keywords
Hexagonal TSV Bundle Topology for 3-D ICs
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Circuits and Systems II: Express Briefs"
DOI: 10.1109/tcsii.2016.2551552
Abstract: Through-substrate vias (TSVs) are key for enabling 3-D integrated circuits (ICs). A hexagonal topology for TSV bundles in 3-D ICs is introduced in this brief. The topology exhibits superior symmetry as compared to the standard… read more here.
Keywords: tsv bundle; hexagonal tsv; ics hexagonal; topology ... See more keywords