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   Articles with "tsv" as a keyword



The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking

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recommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"

DOI: 10.1007/s10854-017-7558-2

Abstract: We investigated the mechanical property of Cu–Cu joints bonded using an ultrasonic bonding and evaluated the reliability of 3D structure stacked by through silicon via (TSV) on glass substrate. TSV was fabricated by using the… read more here.

Keywords: reliability ultrasonic; ultrasonic bonded; bonding strength; tsv ... See more keywords

Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading

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recommendations! Published in 2019 at "Engineering Fracture Mechanics"

DOI: 10.1016/j.engfracmech.2019.01.030

Abstract: Abstract The anisotropy property of silicon is a basic property which has been discussed widely in the reliability assessment of electronic components. However, the effect of silicon anisotropy on the fracture behavior of through-silicon-via (TSV)… read more here.

Keywords: effect silicon; silicon; silicon anisotropy; crack ... See more keywords

Precision 3D profile in-line measurement of through-silicon via (TSV) based on high-frequency spectrum signals in the pupil plane

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recommendations! Published in 2018 at "Optics Communications"

DOI: 10.1016/j.optcom.2018.04.033

Abstract: Abstract As a deep and fine vertical via, through-silicon via (TSV) is a key factor in three-dimensional (3D) integrated circuit stack, which can pass through a silicon wafer or chip for 3D integration. TSV’s 3D… read more here.

Keywords: high frequency; pupil plane; tsv; silicon ... See more keywords

Fabrication and measurement of 3D LPF based on coaxial TSV

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recommendations! Published in 2019 at "Electronics Letters"

DOI: 10.1049/el.2018.7325

Abstract: The implementation of mainstream passive low-pass filters (LPFs) remains a challenge to satisfy the requirements of small size and compatibility with standard CMOS process. Fortunately, the emerging technology of through-silicon via (TSV) offers a possible… read more here.

Keywords: fabrication measurement; lpf based; measurement; based coaxial ... See more keywords
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Internal defects inspection of TSV 3D package based on thermal distribution analysis

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recommendations! Published in 2021 at "AIP Advances"

DOI: 10.1063/5.0056714

Abstract: A small aperture, fine pitch, and high aspect ratio have been the characteristics of through silicon via (TSV) 3D packaging technology. Thus, the requirements of TSV quality are becoming higher and higher. In order to… read more here.

Keywords: internal defects; defects inspection; internal defect; tsv ... See more keywords

First report of tobacco streak virus on Echinacea purpurea (Linn.) Moench in China.

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recommendations! Published in 2022 at "Plant disease"

DOI: 10.1094/pdis-01-22-0216-pdn

Abstract: Tobacco streak virus (TSV) is a member of the genus Ilarvirus in the family Bromoviridae (Vinodkumar et al. 2017). TSV is transmitted by thrips, seeds, pollen, and mechanical injury and has a broad host range,… read more here.

Keywords: tobacco; echinacea purpurea; supplementary fig; virus ... See more keywords

TSV-Defect Modeling, Detection and Diagnosis Based on 3-D Full Wave Simulation and Parametric Measurement

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recommendations! Published in 2018 at "IEEE Access"

DOI: 10.1109/access.2018.2879640

Abstract: In this paper, we present a TSV low-bandwidth equivalent lumped circuit model of common TSV defects as analyzed using a high-frequency structure simulator 3-D full wave simulation. By using the proposed model, the physical parameters… read more here.

Keywords: diagnosis; full wave; wave simulation; tsv defect ... See more keywords

First-Last: A Cost-Effective Adaptive Routing Solution for TSV-Based Three-Dimensional Networks-on-Chip

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recommendations! Published in 2018 at "IEEE Transactions on Computers"

DOI: 10.1109/tc.2018.2822269

Abstract: 3D integration opens up new opportunities for future multiprocessor chips by enabling fast and highly scalable 3D Network-on-Chip (NoC) topologies. However, in an aim to reduce the cost of Through-silicon via (TSV), partially vertically connected… read more here.

Keywords: first last; last cost; tsv; adaptive routing ... See more keywords

Cellular Structure-Based Fault-Tolerance TSV Configuration in 3D-IC

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recommendations! Published in 2022 at "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"

DOI: 10.1109/tcad.2021.3084920

Abstract: In 3-D integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, the yield is one of the key obstacles to adopt the TSV-based 3D-ICs technology in industry. Various… read more here.

Keywords: configuration; structure; tsv; fault tolerance ... See more keywords

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

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recommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"

DOI: 10.1109/tcpmt.2018.2853405

Abstract: In this paper, high-frequency electrothermal characteristics of the power delivery network (PDN) are investigated for through-silicon-via (TSV)-based 3-D ICs by utilizing a self-developed electrothermal co-simulation solver. The solver circularly solves the full-wave electromagnetic equation and… read more here.

Keywords: high frequency; power delivery; frequency; power ... See more keywords

Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm

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recommendations! Published in 2024 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"

DOI: 10.1109/tcpmt.2024.3481036

Abstract: In this work, an effective and efficient optimization strategy for 3-D inductors based on through-silicon via (TSV) is proposed. This strategy is based on the nondominated sorting genetic algorithm-II (NSGA-II) and introduces the artificial neural… read more here.

Keywords: optimization strategy; tsv; algorithm; strategy ... See more keywords