A Physics-Assisted Deep Reinforcement Learning Methodology for Signal and Power Integrity Optimization of Large-Scale TSV Arrays
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2025.3574142
Abstract: The signal integrity (SI) and power integrity (PI) optimization of through-silicon via (TSV) arrays in high-bandwidth memory (HBM) is crucial for enhancing system reliability. However, previous studies mostly focused on individual SI or PI optimization… read more here.
Keywords: methodology; tsv arrays; integrity; optimization ... See more keywords
An equivalent thermal conductivity model of TSV arrays for thermal analysis in 3-D integrated circuits
Sign Up to like & getrecommendations! Published in 2024 at "Thermal Science"
DOI: 10.2298/tsci230919129x
Abstract: As the CMOS technology continuously scales down into the deep submicron regime and approaches the physical limits of minimization, Moore's Law is hindered. The proposed three-dimensional integrated circuit (3-D IC) technology based on through silicon… read more here.
Keywords: equivalent thermal; tsv arrays; analysis; conductivity ... See more keywords