TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Very Large Scale Integration (VLSI) Systems"
DOI: 10.1109/tvlsi.2023.3248042
Abstract: High-bandwidth memory (HBM) is the latest 3-D-stacked dynamic random access memory (DRAM) standard adopted in Joint Electron Device Engineering Council (JEDEC). It has many advantages, such as high bandwidth, large capacity, and low power consumption,… read more here.
Keywords: tsv built; self repair; yield reliability; built self ... See more keywords