MTL-based modeling and analysis of the effects of TSV noise coupling on the power delivery network in 3D ICs
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DOI: 10.1007/s10825-020-01466-w
Abstract: With the application of heterogeneous integration and advanced packaging technologies, the use of through-silicon vias (TSVs) to deliver the power supply has become popular in the design of stacked chips in three-dimensional integrated circuits. High-density vertical… read more here.
Keywords: network; tsv noise; analysis; power ... See more keywords