Heterogeneous Integrated Microsystems With Nontraditional Through-Silicon Via Technologies
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2678461
Abstract: In this paper, the design, fabrication, and high-frequency characterization of three types of nontraditional through-silicon via (TSV) technologies are discussed. First, the integration of TSVs within a silicon microfluidic heat sink is presented; TSVs are… read more here.
Keywords: tsvs; silicon via; heterogeneous integrated; nontraditional silicon ... See more keywords