Effect of Controlling Abrasive Size in Slurry for Tungsten Contact CMP Process
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DOI: 10.1149/2.0311905jss
Abstract: Tungsten contact chemical mechanical polishing is a critical process in advanced node semiconductor device manufacturing that enables metal interconnection. It is essential for device performance, and any defects caused by the tungsten CMP process have… read more here.
Keywords: slurry; cmp process; abrasive size; tungsten contact ... See more keywords