Tutorial on forming through-silicon vias
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DOI: 10.1116/6.0000026
Abstract: Through-silicon vias (TSVs) are a critical technology for three-dimensional integrated circuit technology. These through-substrate interconnects allow electronic devices to be stacked vertically for a broad range of applications and performance improvements such as increased bandwidth,… read more here.
Keywords: seed; silicon vias; tutorial forming; technology ... See more keywords