Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/Sn/Cu microjoints
Sign Up to like & getrecommendations! Published in 2022 at "Materials Chemistry and Physics"
DOI: 10.1016/j.matchemphys.2021.125307
Abstract: Abstract High-density interconnection technology is critical for semiconductor packages, which require high speed and multifunctional demands. The shrinkage of solder volume is needed for the miniaturization of devices. Fewer studies investigate using Cu3Sn than Cu6Sn5… read more here.
Keywords: solder volume; cu3sn; type cu3sn; porous type ... See more keywords