Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment
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DOI: 10.3390/ma16031066
Abstract: Chloride ions contained in the sealing compound currently used in the electronic packaging industry not only interact with intermetallic compounds but also have a serious impact on silver alloy wires. A 15 μm ultrafine quaternary… read more here.
Keywords: chloride ions; ultrafine quaternary; wire; silver alloy ... See more keywords