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Published in 2022 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.2c04136
Abstract: Ultralight highly porous sponges are attractive for electronic devices due to superelasticity, outstanding resilience, and thermal insulation. However, fabricating an ultralight conductive sponge with low thermal conductivity, mechanical flexibility, and piezoresistivity, as well as adjustable…
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Keywords:
carbon;
ultralight heat;
electrically conductive;
sponge ... See more keywords