The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking
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DOI: 10.1007/s10854-017-7558-2
Abstract: We investigated the mechanical property of Cu–Cu joints bonded using an ultrasonic bonding and evaluated the reliability of 3D structure stacked by through silicon via (TSV) on glass substrate. TSV was fabricated by using the… read more here.
Keywords: reliability ultrasonic; ultrasonic bonded; bonding strength; tsv ... See more keywords