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Published in 2020 at "IEEE Transactions on Semiconductor Manufacturing"
DOI: 10.1109/tsm.2019.2963483
Abstract: As extreme ultraviolet (EUV) lithography enters high volume manufacturing (HVM) to enable the sub-7nm scaling roadmap, characterizing and monitoring defects that print at wafer level are of critical importance to yield. This is especially true…
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Keywords:
stochastic defects;
euv;
ultraviolet euv;
inspection ... See more keywords