BUP: A Deadlock Resolution Framework for 2.5D Chiplet Networks by Update Packet Bypassing
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DOI: 10.1109/jetcas.2025.3590870
Abstract: Interposer-based 2.5D integration, as a promising packaging technology, is extensively applied in chiplet-based systems. However, even if both the interposer and chiplets are deadlock-free, new deadlocks may still occur across them after integration. To address… read more here.
Keywords: deadlock resolution; resolution framework; chiplet; update packet ... See more keywords