Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al.
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DOI: 10.1016/j.ultsonch.2018.04.010
Abstract: To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg2Sn formed in the soldered joints during this process… read more here.
Keywords: assisted soldering; control intermetallic; using 9zn; formation ... See more keywords