Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep
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DOI: 10.1007/s11340-017-0258-2
Abstract: In this paper, the mechanical properties and creep behavior of lead-free solder joints has been characterized by nano-mechanical testing of single grain SAC305 solder joints extracted from plastic ball grid array (PBGA) assemblies. The anisotropic… read more here.
Keywords: using nanoindentation; solder joints; anisotropic mechanical; mechanical properties ... See more keywords