Reflow Soldering Capability Improvement by Utilizing TaN Interfacial Layer in 1Mbit RRAM Chip
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DOI: 10.3390/mi13040567
Abstract: We investigated the thermal stability of a 1Mbit OxRRAM array embedded in 28 nm COMS technology. A back-end-of-line (BEOL) solution with a TaN–Ta interfacial layer was proposed to eliminate the failure rate after reflow soldering… read more here.
Keywords: reflow soldering; interfacial layer; utilizing tan; tan interfacial ... See more keywords