Interfacial microstructure of Ti/Ni joints with Ti–Al interlayer by rapid thermal explosion bonding in vacuum
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DOI: 10.1016/j.vacuum.2019.109028
Abstract: Abstract The present study investigated the joining between Ti and Ni by rapid thermal explosion (TE) in vacuum of read more here.
Keywords: thermal explosion; interfacial microstructure; rapid thermal; vacuum interfacial ... See more keywords