Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions
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DOI: 10.3390/ma16020750
Abstract: Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service life but are also influenced by aging. There has been limited investigation into the influence of aging and varying cycles on… read more here.
Keywords: sac solder; stress; solder; solder joints ... See more keywords