Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits
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DOI: 10.1016/j.scriptamat.2018.09.026
Abstract: Abstract Self-assembled Au atoms were employed to bond vertical interconnection for chip-stacking applications without pressure and at a temperature of 50 °C. In this process, Au ions in an electroless plating solution are forced through a… read more here.
Keywords: vertical interconnections; atoms vertical; assembly reduced; reduced atoms ... See more keywords