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Published in 2025 at "Advanced Electronic Materials"
DOI: 10.1002/aelm.202500066
Abstract: Integrating piezoelectric materials onto the vertical surfaces of microelectromechanical systems (MEMS) microstructures enables three‐dimensional piezoelectric (3D piezoMEMS) devices, providing multi‐axis sensing and actuation capabilities with a reduced device footprint. Metal–organic chemical vapor deposition (MOCVD) is…
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Keywords:
quality;
quality functional;
vertical sidewall;
enhanced vertical ... See more keywords