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Published in 2024 at "Nano letters"
DOI: 10.1021/acs.nanolett.4c00046
Abstract: Multisensory integration enables the simultaneous perception of multiple environmental stimuli while minimizing size and energy consumption. However, conventional multifunctional integration in flexible electronics typically requires large-scale horizontal sensing arrays (such as flexible printed circuit boards),…
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Keywords:
integration;
vertical stacking;
multimodal sensing;
strategy ... See more keywords
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Published in 2025 at "IEEE Electron Device Letters"
DOI: 10.1109/led.2025.3629762
Abstract: Although one-transistor DRAM (1T-DRAM) can eliminate storage capacitors and simplify fabrication, most reported devices to date rely on 3-terminal structures with single-crystalline channels, which restrict integration density and vertical stacking. In this letter, we propose…
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Keywords:
polycrystalline silicon;
vertical stacking;
dram cell;
dram ... See more keywords