Local Fermi Level Engineering in 2D‐MoS2 Realized via Microcontact Printing of Self‐Assembled Monolayers for Next‐Generation Electronics
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DOI: 10.1002/aelm.202500081
Abstract: Silicon‐based technology is approaching scalability limits due to severe short‐channel effects arising from its intrinsic bulk properties. In contrast, two‐dimensional (2D) transition metal dichalcogenides (TMDCs) exhibit remarkable resilience to these effects because of their atomic‐scale… read more here.
Keywords: next generation; via microcontact; engineering; self assembled ... See more keywords