Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications
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DOI: 10.1109/jmems.2016.2624423
Abstract: Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor… read more here.
Keywords: invar metal; silicon vias; high temperature; vias invar ... See more keywords