Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module
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DOI: 10.1177/1464420718780525
Abstract: In this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue mechanism under each loading… read more here.
Keywords: vibration loading; fatigue life; vibration; thermal cycling ... See more keywords