Articles with "void formation" as a keyword



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Three-Dimensional Numerical Simulation of Meso-Scale-Void Formation during the Mold-Filling Process of LCM

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Published in 2019 at "Applied Composite Materials"

DOI: 10.1007/s10443-019-09770-w

Abstract: Voids formed during liquid composite molding significantly degenerates mechanical performances of the final products, accurate prediction of the formation and size of void has significance for the parameter design of LCM. However, the 3D simulation… read more here.

Keywords: meso scale; formation; void formation; scale void ... See more keywords
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Understanding of Void Formation in Cu/Sn-Sn/Cu System During Transient Liquid Phase Bonding Process Through Diffusion Modeling

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Published in 2018 at "Metallurgical and Materials Transactions B"

DOI: 10.1007/s11663-018-1391-8

Abstract: Transient Liquid Phase (TPL) bounding of Sn foil sandwiched between two Cu foils involves, in the temperature range above the melting point of Sn (232 °C) and below 350 °C, the formation and the growth of two… read more here.

Keywords: phase; transient liquid; diffusion; void formation ... See more keywords
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Stochastic modeling of through the thickness permeability variation in a fabric and its effect on void formation during Vacuum Assisted Resin Transfer Molding

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Published in 2017 at "Composites Science and Technology"

DOI: 10.1016/j.compscitech.2017.06.016

Abstract: Abstract Resin flow during Vacuum Assisted Resin Transfer Molding (VARTM) process, when distribution media (DM) is placed on top of the reinforcement, is largely affected by variation in through the thickness permeability of a woven… read more here.

Keywords: resin; variation; permeability; effect ... See more keywords
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Modeling of central void formation in LWR fuel pellets due to high-temperature restructuring

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Published in 2018 at "Nuclear Engineering and Technology"

DOI: 10.1016/j.net.2018.07.003

Abstract: Abstract Analysis of the GRSW-A model coupled into the FALCON code is extended by simulation of central void formation in fuel pellets due to high-temperature fuel restructuring. The extended calculation is verified against published, well-known… read more here.

Keywords: temperature; pellets due; void formation; fuel ... See more keywords
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Observation of Void Formation in Cubic NaYF4 Nanocrystals Using In Situ Heating Transmission Electron Microscopy

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Published in 2019 at "Microscopy and Microanalysis"

DOI: 10.1017/s1431927619008213

Abstract: Lanthanide-doped sodium yttrium fluoride (NaYF4) nanocrystals have been heavily studied for their upconverting properties [1–3] and specifically their potential for laser cooling [4,5]. NaYF4 is also notable for its two crystallographic polymorphs, cubic (α) and… read more here.

Keywords: void formation; microscopy; nayf4 nanocrystals; observation void ... See more keywords
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Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface

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Published in 2017 at "Nature Communications"

DOI: 10.1038/s41467-017-02154-3

Abstract: Cavitation and hollow structures can be introduced in nanomaterials via the Kirkendall effect in an alloying or reaction system. By introducing dense nanoscale twins into copper nanowires (CuNWs), we change the surface structure and prohibit… read more here.

Keywords: oxidation; kirkendall effect; surface; copper ... See more keywords
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Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

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Published in 2017 at "Scientific Reports"

DOI: 10.1038/s41598-017-06250-8

Abstract: In this investigation, SnAgCu and SN100C solders were electromigration (EM) tested, and the 3D laminography imaging technique was employed for in-situ observation of the microstructure evolution during testing. We found that discrete voids nucleate, grow… read more here.

Keywords: void formation; electromigration mechanism; current density; solder ... See more keywords
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Real-time atomic scale observation of void formation and anisotropic growth in II-VI semiconducting ribbons.

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Published in 2017 at "Nanoscale"

DOI: 10.1039/c7nr02231j

Abstract: Void formation in semiconductors is generally considered to be deteriorating. However, for some systems, void formation and evolution are beneficial and can be used for the fabrication of novel nanostructures. In either scenario, the understanding… read more here.

Keywords: void formation; growth; real time; formation ... See more keywords
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Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

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Published in 2017 at "IEEE Transactions on Reliability"

DOI: 10.1109/tr.2017.2759231

Abstract: Since the introduction of lead-free solder alloys, the impact of voids in solder joints has rapidly gained in importance. Particularly in power electronics, voids in solder joints can reduce their reliability due to less heat… read more here.

Keywords: lead free; solder joints; void formation; solder ... See more keywords
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The void formation behaviors in working solid-state Li metal batteries

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Published in 2022 at "Science Advances"

DOI: 10.1126/sciadv.add0510

Abstract: The fundamental understanding of the elusive evolution behavior of the buried solid-solid interfaces is the major barrier to exploring solid-state electrochemical devices. Here, we uncover the interfacial void evolution principles in solid-state batteries, build a… read more here.

Keywords: solid state; state; void formation; metal batteries ... See more keywords