Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-8096-7
Abstract: Micron level Cu-pillar microbumps, which appear as the size of three-dimensional packaging shrinks down, have to introduce many unexpected reliability problems. The fast growth of intermetallic compounds (IMC) and voids tend to be a serious… read more here.
Keywords: voids growth; intermetallic compound; investigation intermetallic; growth fine ... See more keywords
The influences of Ag nanoparticles on voids growth and solderability about Sn3.0Ag0.5Cu/Cu solder joint
Sign Up to like & getrecommendations! Published in 2024 at "Materials Research Express"
DOI: 10.1088/2053-1591/ad4197
Abstract: Although Sn3.0Ag0.5Cu solder (SAC305) has higher reliability, there are a large number of harmful voids in solder joints. Larger voids can reduce thermal conductivity of solder joints. However, as a microstructure growth inhibitor, the influences… read more here.
Keywords: sn3 0ag0; 0ag0 5cu; solder; voids growth ... See more keywords