Optimizing the dicing saw parameters of 60 μm wafer dicing street
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DOI: 10.1007/s00542-017-3553-z
Abstract: Wafer surface dicing chipping can expand to impact chip circuits, which may cause serious defects during the IC assembly process, potentially resulting in IC circuit function failure. Throughout the semiconductor wafer process, the street design… read more here.
Keywords: street; dicing saw; optimizing dicing; wafer dicing ... See more keywords
A Study of Ammonium Bifluoride as an Agent for Cleaning Silicon Contamination in the Wafer Dicing Process
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DOI: 10.3390/app13095294
Abstract: A new cleaning agent for silicon contamination in the wafer dicing process was formulated in this research. Ammonium bifluoride was introduced as the main ingredient in the formula, and MSA and sulfuric acid were added… read more here.
Keywords: contamination; silicon contamination; wafer dicing; dicing process ... See more keywords