Contact etch process optimization for RF process wafer edge yield improvement
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Semiconductors"
DOI: 10.1088/1674-4926/40/12/122402
Abstract: Radio-frequency (RF) process products suffer from a wafer edge low yield issue, which is induced by contact opening. A failure mechanism has been proposed that is based on the characteristics of a wafer edge film… read more here.
Keywords: wafer edge; process; yield; contact etch ... See more keywords
Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma
Sign Up to like & getrecommendations! Published in 2022 at "Nanomaterials"
DOI: 10.3390/nano12223963
Abstract: Recently, the uniformity in the wafer edge area that is normally abandoned in the fabrication process has become important for improving the process yield. The wafer edge structure normally has a difference of height between… read more here.
Keywords: etch profile; edge area; wafer edge; wafer ... See more keywords