Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface
Sign Up to like & getrecommendations! Published in 2023 at "Materials"
DOI: 10.3390/ma16103619
Abstract: Hard and brittle materials such as monocrystalline silicon still occupy an important position in the semiconductor industry, but hard and brittle materials are difficult to process because of their physical properties. Fixed-diamond abrasive wire-saw cutting… read more here.
Keywords: cutting force; wire saw; wire; wafer surface ... See more keywords
A full-flow inspection method based on machine vision to detect wafer surface defects
Sign Up to like & getrecommendations! Published in 2023 at "Mathematical Biosciences and Engineering"
DOI: 10.3934/mbe.2023526
Abstract: The semiconductor manufacturing industry relies heavily on wafer surface defect detection for yield enhancement. Machine learning and digital image processing technologies have been used in the development of various detection algorithms. However, most wafer surface… read more here.
Keywords: inspection method; wafer surface; method based; method ... See more keywords