Vertically Replaceable Memory Block Architecture for Stacked DRAM Systems by Wafer-on-Wafer (WOW) Technology
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DOI: 10.1109/ted.2020.3010894
Abstract: This article proposes a 3-D-based redundancy scheme for the stacked dynamic random-access memory (DRAM) systems, which enables highly efficient productivity with the wafer-on-wafer (WOW) technology. Vertically replaceable block scheme and redundantly added wafer stack(s) are… read more here.
Keywords: dram systems; memory; technology; wafer wafer ... See more keywords