Influence of rapid thermal annealing on the wafer warpage in 3D NAND flash memory
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DOI: 10.1088/1361-6641/aafccd
Abstract: In this study, the wafer warpage resulting from common source line tungsten (CSL W) is investigated in 3D NAND flash memory. It is found that the warpage is related to the annealing conditions after CSL… read more here.
Keywords: flash memory; warpage; wafer warpage; nand flash ... See more keywords