Crystallinity Change and Reduced Warpages on Thin Walled Parts-the Effect of Nano Fumed Silica on Polyacetal
Sign Up to like & getrecommendations! Published in 2020 at "Silicon"
DOI: 10.1007/s12633-020-00796-5
Abstract: Polyacetal is widely used in thin walled injection moulding due to its high mechanical properties. But, its widespread application is limited due to volumetric shrinkage and warpage. The investigations on reducing warpage on Polyacetal is… read more here.
Keywords: crystallinity; fumed silica; nano fumed; walled parts ... See more keywords
Optimization of process parameters for reducing warpage in selected laser sintering of polymer parts
Sign Up to like & getrecommendations! Published in 2017 at "Additive manufacturing"
DOI: 10.1016/j.addma.2017.10.018
Abstract: Abstract Selective Laser Sintering (SLS) is a rapidly growing additive manufacturing process, because it has the capacity to build parts from a variety of materials. However, the dimensional accuracy of the fabricated parts in this… read more here.
Keywords: polymer; optimization process; process; warpage ... See more keywords
Influence of rapid thermal annealing on the wafer warpage in 3D NAND flash memory
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DOI: 10.1088/1361-6641/aafccd
Abstract: In this study, the wafer warpage resulting from common source line tungsten (CSL W) is investigated in 3D NAND flash memory. It is found that the warpage is related to the annealing conditions after CSL… read more here.
Keywords: flash memory; warpage; wafer warpage; nand flash ... See more keywords
Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages1
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Applied Crystallography"
DOI: 10.1107/s1600576717003132
Abstract: X-ray diffraction imaging in both monochromatic and white beam section mode has been used to measure quantitatively the displacement and warpage stress in encapsulated silicon devices. read more here.
Keywords: ray diffraction; diffraction measurement; warpage; nondestructive ray ... See more keywords
Dynamic warpage simulation of molded PCB under reflow process
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DOI: 10.1108/cw-02-2021-0061
Abstract: Purpose This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpage behavior for different form factor sizes. Design/methodology/approach This study analyzes… read more here.
Keywords: temperature; process; molded pcb; warpage ... See more keywords
Empirical process model for shrinkage-induced warpage in 3D printing
Sign Up to like & getrecommendations! Published in 2019 at "Rapid Prototyping Journal"
DOI: 10.1108/rpj-04-2018-0098
Abstract: Purpose The purpose of this work is to explain the emergence of warpage due to a locally and temporally inhomogeneous shrinkage in 3D printing (Binder-Jetting) of polymers. Design/methodology/approach An analysis of shrinkage yields parameters for… read more here.
Keywords: shrinkage; warpage; process; process model ... See more keywords
Global Optimization of Surface Warpage for Inverse Design of Ultra-Thin Electronic Packages using Tensor Train Decomposition
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DOI: 10.1109/access.2022.3170455
Abstract: As laptops get thinner and thinner, the electronic packages that go into these devices must shrink along the z-dimension as well. High warpage in these ultra-thin packages is the result of mismatch of coefficients of… read more here.
Keywords: electronic packages; warpage; ultra thin; warpage inverse ... See more keywords
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/ectc.2017.309
Abstract: In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip… read more here.
Keywords: wafer level; level packaging; warpage thermal; warpage ... See more keywords
Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2726084
Abstract: Nowadays, fan-out package is regarded as one of the latest and most potential technologies because it possesses lower cost, thinner profile, and better electrical performance and thermal performance. However, thermally induced warpage in the molding… read more here.
Keywords: process; geometry; fan package; warpage ... See more keywords
Study on Warpage and Reliability of Fan-Out Interposer Technology
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DOI: 10.1109/tcpmt.2018.2889308
Abstract: The fan-out interposer (FOI) technology with fine pitch is demonstrated and presented for heterogeneous integration as a cost-effective and enabling technology. The co-design modeling methodology is established for the FOI technology, including wafer process-induced warpage,… read more here.
Keywords: warpage; technology; reliability; fan interposer ... See more keywords
Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.2975571
Abstract: A six-side molded wafer-level chip scale package (mWLCSP) is a novel and attractive packaging method for smart phone applications due to its lower cost, better electrical performance, and higher long-term reliability. Nevertheless, wafer warpage in… read more here.
Keywords: control; packaging processes; warpage; six side ... See more keywords