Global Optimization of Surface Warpage for Inverse Design of Ultra-Thin Electronic Packages using Tensor Train Decomposition
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DOI: 10.1109/access.2022.3170455
Abstract: As laptops get thinner and thinner, the electronic packages that go into these devices must shrink along the z-dimension as well. High warpage in these ultra-thin packages is the result of mismatch of coefficients of… read more here.
Keywords: electronic packages; warpage; ultra thin; warpage inverse ... See more keywords