Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
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DOI: 10.1109/ectc.2017.309
Abstract: In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip… read more here.
Keywords: wafer level; level packaging; warpage thermal; warpage ... See more keywords