Wear of inorganic materials upon wafering using an abrasive tool
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DOI: 10.3103/s1068366616060039
Abstract: The principles of the influence of cutting conditions on the surface temperature in the wafering zone of silicate glass using an abrasive tool have been determined. The features and types of destruction of the layer… read more here.
Keywords: upon wafering; abrasive tool; using abrasive; inorganic materials ... See more keywords