Effect of Substrate Composition on Whisker Growth in Sn Coatings
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DOI: 10.1007/s11664-018-6275-9
Abstract: Whisker growth was studied in Sn coatings deposited on three different substrates, namely pure Cu, brass (Cu-35 wt.% Zn) and pure Ni. Additionally, the effect of a Ni under-layer (electro- or sputter-deposited and placed between the… read more here.
Keywords: whisker; coatings deposited; substrate composition; whisker growth ... See more keywords
Critical Evaluation of Relative Importance of Stress and Stress Gradient in Whisker Growth in Sn Coatings
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6391-6
Abstract: The role of stress state and stress gradient in whisker growth in Sn coatings electrodeposited on brass is examined. The bulk stress in Sn coatings was measured using a laser-optics-based curvature setup, whereas glancing angle… read more here.
Keywords: stress gradient; stress; whisker growth;
Recent Advances in Mitigation of Whiskers from Electroplated Tin
Sign Up to like & getrecommendations! Published in 2019 at "JOM"
DOI: 10.1007/s11837-019-03933-7
Abstract: Tin whiskers pose an electrical reliability risk in the form of potential short circuits. This problem was solved in the past by adding a few percent of Pb during Sn electroplating, but with the ban… read more here.
Keywords: mitigation whiskers; advances mitigation; whiskers electroplated; mitigation ... See more keywords
Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints
Sign Up to like & getrecommendations! Published in 2019 at "Applied Sciences"
DOI: 10.3390/app9071406
Abstract: The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn3 phase nor… read more here.
Keywords: whisker growth; tin whisker; soldered joints;
Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
Sign Up to like & getrecommendations! Published in 2023 at "Materials"
DOI: 10.3390/ma16051852
Abstract: This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a… read more here.
Keywords: sn0 7cu0; whisker growth; 05ni solder; 7cu0 05ni ... See more keywords
Evidence for a High Temperature Whisker Growth Mechanism Active in Tungsten during In Situ Nanopillar Compression
Sign Up to like & getrecommendations! Published in 2021 at "Nanomaterials"
DOI: 10.3390/nano11092429
Abstract: A series of nanopillar compression tests were performed on tungsten as a function of temperature using in situ transmission electron microscopy with localized laser heating. Surface oxidation was observed to form on the pillars and… read more here.
Keywords: temperature; mechanism; growth mechanism; whisker growth ... See more keywords