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1
Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6275-9
Abstract: Whisker growth was studied in Sn coatings deposited on three different substrates, namely pure Cu, brass (Cu-35 wt.% Zn) and pure Ni. Additionally, the effect of a Ni under-layer (electro- or sputter-deposited and placed between the…
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Keywords:
whisker;
coatings deposited;
substrate composition;
whisker growth ... See more keywords
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1
Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6391-6
Abstract: The role of stress state and stress gradient in whisker growth in Sn coatings electrodeposited on brass is examined. The bulk stress in Sn coatings was measured using a laser-optics-based curvature setup, whereas glancing angle…
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Keywords:
stress gradient;
stress;
whisker growth;
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1
Published in 2019 at "JOM"
DOI: 10.1007/s11837-019-03933-7
Abstract: Tin whiskers pose an electrical reliability risk in the form of potential short circuits. This problem was solved in the past by adding a few percent of Pb during Sn electroplating, but with the ban…
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Keywords:
mitigation whiskers;
advances mitigation;
whiskers electroplated;
mitigation ... See more keywords
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0
Published in 2025 at "Marine Mammal Science"
DOI: 10.1111/mms.13229
Abstract: Stable isotope analysis of animal tissues is a valuable tool for understanding foraging ecology, habitat use, and developmental changes throughout an animal's life. Stable isotope values of whisker segments offer long‐term data on mammalian foraging,…
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Keywords:
whisker growth;
isotope;
whisker;
stable isotope ... See more keywords
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1
Published in 2019 at "Applied Sciences"
DOI: 10.3390/app9071406
Abstract: The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn3 phase nor…
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Keywords:
whisker growth;
tin whisker;
soldered joints;
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1
Published in 2023 at "Materials"
DOI: 10.3390/ma16051852
Abstract: This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a…
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Keywords:
sn0 7cu0;
whisker growth;
05ni solder;
7cu0 05ni ... See more keywords
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1
Published in 2021 at "Nanomaterials"
DOI: 10.3390/nano11092429
Abstract: A series of nanopillar compression tests were performed on tungsten as a function of temperature using in situ transmission electron microscopy with localized laser heating. Surface oxidation was observed to form on the pillars and…
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Keywords:
temperature;
mechanism;
growth mechanism;
whisker growth ... See more keywords