Pt-RuAl bilayers as a model system for Pt wire bonding of high-temperature RuAl electrodes
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2019.152107
Abstract: Abstract For the application of RuAl as a metallization in wireless high-temperature surface acoustic wave devices an electrical connection between the RuAl interdigital transducer and an antenna is necessary. Such an electrical contact can be… read more here.
Keywords: wire bonding; high temperature; system; rual bilayers ... See more keywords
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
Sign Up to like & getrecommendations! Published in 2021 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2021.114077
Abstract: Abstract Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like… read more here.
Keywords: process; wire bonding; wire; bond ... See more keywords
A Novel Vertical Wire-Bonding Compensation Structure Adaptively Modeled and Optimized With GRNN and GA Methods for System in Package
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Transactions on Electromagnetic Compatibility"
DOI: 10.1109/temc.2021.3064853
Abstract: In this article, a novelvertical wire-bonding interconnect structure is intelligently modeled and optimized with general artificial neural network (GRNN) and genetic algorithm (GA) for multilayered system in package. A compensation structure is constructed with a… read more here.
Keywords: system; modeled optimized; wire bonding; structure ... See more keywords
Direct Chip-to-Waveguide Transition Realized With Wire Bonding for 140–220 GHz G-Band
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Terahertz Science and Technology"
DOI: 10.1109/tthz.2020.2971690
Abstract: This work presents a method to realize a direct chip-to-waveguide transition by means of commercial wire-bonding tools. A straight E-field probe is formed by a freely suspended bondwire and mounted to a standard RF pad… read more here.
Keywords: chip waveguide; waveguide transition; direct chip; wire bonding ... See more keywords
Direct optical wire bonding through open-to-air polymerization for silicon photonic chips: publisher's note.
Sign Up to like & getrecommendations! Published in 2022 at "Optics letters"
DOI: 10.1364/ol.455707
Abstract: This publisher's note contains a correction to Opt. Lett. 47, 714 (2022). read more here.
Keywords: publisher note; optical wire; direct optical; publisher ... See more keywords
A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing
Sign Up to like & getrecommendations! Published in 2022 at "IEEE Access"
DOI: 10.48550/arxiv.2206.07481
Abstract: Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and… read more here.
Keywords: die attachment; attachment wire; survey; detection ... See more keywords