A Way to Reduce Leakage Current and Improve Reliability of Wire-Bonds for 300-A Multichip SiC Hybrid Modules
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DOI: 10.1109/jestpe.2020.3028132
Abstract: In this article, pressureless sintering of nanosilver paste is proposed to enhance the reliability of wire-bonds with SiC chips by both alleviating thermomechanical stresses and enhancing thermal coupling of bonding wires and chips. A multichip… read more here.
Keywords: sic hybrid; leakage current; reliability wire; wire bonds ... See more keywords