Kinetic mechanism of aluminum removal from diamond wire saw powder in HCl solution.
Sign Up to like & getrecommendations! Published in 2019 at "Journal of hazardous materials"
DOI: 10.1016/j.jhazmat.2019.01.020
Abstract: Impurity removal is essential for the recovery and regeneration of silicon resources from diamond wire saw powder by metallurgical purification technologies. In this paper, the aluminum was removed from the diamond wire saw powder via… read more here.
Keywords: hcl; diamond wire; saw powder; wire saw ... See more keywords
Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface
Sign Up to like & getrecommendations! Published in 2023 at "Materials"
DOI: 10.3390/ma16103619
Abstract: Hard and brittle materials such as monocrystalline silicon still occupy an important position in the semiconductor industry, but hard and brittle materials are difficult to process because of their physical properties. Fixed-diamond abrasive wire-saw cutting… read more here.
Keywords: cutting force; wire saw; wire; wafer surface ... See more keywords