Ultrasonication pretreatment of diamond wire sawn multi-crystalline silicon wafers for texturing
Sign Up to like & getrecommendations! Published in 2018 at "Materials Science in Semiconductor Processing"
DOI: 10.1016/j.mssp.2017.09.031
Abstract: Abstract Ultrasonication vibration as the pretreatment process, combined with wet acid etching, was utilized for the texture of diamond wire sawn (DWS) multi-crystalline silicon wafers. The SiC particles in the ultrasonic device were imposed for… read more here.
Keywords: wire sawn; silicon wafers; silicon; pretreatment ... See more keywords
A metal-free additive texturization method used for diamond-wire-sawn multi-crystalline silicon wafers
Sign Up to like & getrecommendations! Published in 2020 at "Materials Science in Semiconductor Processing"
DOI: 10.1016/j.mssp.2020.105187
Abstract: Abstract Diamond-wire-sawn (DWS) technique has been widely applied in PV industry. However, this technique still has a big challenge when it is used for multi-crystalline silicon (mc-Si) because its reflectivity of DWS mc-Si etched by… read more here.
Keywords: crystalline silicon; wire sawn; multi crystalline; silicon ... See more keywords
Effects of H2O2, Cu(NO3)2 and HF temperatures on surface texturization of diamond-wire-sawn multicrystalline silicon wafer
Sign Up to like & getrecommendations! Published in 2020 at "Solar Energy Materials and Solar Cells"
DOI: 10.1016/j.solmat.2020.110583
Abstract: Abstract Previous studies have considered the same temperature for all components of the silicon etching solution, and the effect of the temperature of the individual components on the etching results has not been explored. In… read more here.
Keywords: silicon wafer; wafer; wire sawn; effects h2o2 ... See more keywords