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Published in 2020 at "IEEE Journal of Solid-State Circuits"
DOI: 10.1109/jssc.2020.2989543
Abstract: Wireless 3-D integration using inductive coupling links (ICLs) has recently gained attention as a low-cost alternative to through-silicon vias (TSVs) for interconnecting stacked silicon tiers. However, 3-D integration using ICLs is often criticized for its…
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Keywords:
spike latency;
wireless integration;
low energy;
integration ... See more keywords